The Story
- Made and printed in the USA
- Will fit 1/0 AWG, 1 AWG & 2 AWG
- Available in Red
B2 Audio 10 Pack of 0 Gauge Red Heat Shrink with B2 Riot Guy
This listing includes
- (10) 0 Gauge Red Heat Shrink with B2 Riot Guy pcs
Introducing our 2" Heat Shrink Tubing, the ultimate choice for any true BASSHEAD! Each section comes adorned with the bold and stylish "B2 Riot Guy" logo. Enhance your cable management and customization projects with ease while making a statement that's as powerful as your bass beats. It's time to amplify your style and protect your connections with our B2 Audio Heat Shrink Tubing.
Specifications
- Will fit 1/0 AWG, 1 AWG & 2 AWG
- 3:1 Shrink Ratio (shrinks to 1/3 its original diameter)
- Maximum Continuous use temperature 135C
- Shrink Temperature of 100C and operating temperature of -55C to + 135C
- Typical applications include: Insulation, Wire Identification, Wire Bundling, Mechanical Protection, Color Coding, Lightweight Harnessing, Physical/Electrical Protection of Components, Strain Relief, and Solder Insulation.
Details & Craftsmanship
Every detail has been carefully considered to bring you the perfect product.
Description
- Made and printed in the USA
- Will fit 1/0 AWG, 1 AWG & 2 AWG
- Available in Red
B2 Audio 10 Pack of 0 Gauge Red Heat Shrink with B2 Riot Guy
This listing includes
- (10) 0 Gauge Red Heat Shrink with B2 Riot Guy pcs
Introducing our 2" Heat Shrink Tubing, the ultimate choice for any true BASSHEAD! Each section comes adorned with the bold and stylish "B2 Riot Guy" logo. Enhance your cable management and customization projects with ease while making a statement that's as powerful as your bass beats. It's time to amplify your style and protect your connections with our B2 Audio Heat Shrink Tubing.
Specifications
- Will fit 1/0 AWG, 1 AWG & 2 AWG
- 3:1 Shrink Ratio (shrinks to 1/3 its original diameter)
- Maximum Continuous use temperature 135C
- Shrink Temperature of 100C and operating temperature of -55C to + 135C
- Typical applications include: Insulation, Wire Identification, Wire Bundling, Mechanical Protection, Color Coding, Lightweight Harnessing, Physical/Electrical Protection of Components, Strain Relief, and Solder Insulation.
